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chip packaging facility in indiana

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2024-12-19
Bloomberg 2 related

The US finalizes a $458M grant for SK Hynix under the CHIPS Act and $500M in loans to build a $3.87B chip packaging facility in Indiana

Mackenzie Hawkins / Bloomberg :

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2024-08-06
Bloomberg 11 related

The US awards South Korea's SK Hynix an initial $450M in grants and $500M in loans to build an advanced chip packaging facility in Indiana under the CHIPS Act

- Firm to get $450 million Chips Act grant, $500 million loan  — Indiana facility focused on advanced packaging, research

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