A look at Seattle-based Cloverleaf, which signs deals with utility companies and secures land for AI companies' data center needs; the startup has raised $300M
Brian Janous, a former Microsoft executive, and his firm Cloverleaf have become modern-day land men, packaging electricity and land for data centers.
ASML CTO Marco Pieters says ASML plans to expand beyond EUV into advanced packaging, bonding, and connecting, and is building AI-based machine inspection tools
ASML Holding (ASML.AS) has ambitious plans to expand its line of chipmaking equipment into several new products to capture …
SK Hynix will invest ~$12.9B to build an advanced chip packaging plant in South Korea to meet rising memory chip demand, targeting completion by the end of 2027
South Korea's SK Hynix (000660.KS) said on Tuesday it has decided to invest 19 trillion won ($12.90 billion) …
Apple's Vision Pro with the M5 chip is assembled in Vietnam, according to labels on its packaging; the M2-based model, launched in 2024, was built in China
Apple Inc.'s new Vision Pro headset doesn't offer much in the way of fresh features, but the company made a notable change to its production.
Apple doesn't include a charger in the box with the 14-inch M5 MacBook Pro in European countries, making users pay extra; the company cites an upcoming EU law
Here's Why Antonio G. Di Benedetto / The Verge : Apple announces new MacBook Pro with M5 chip Spencer Hart / Stuff : Apple won't include a charger with the new MacBook Pro M5, I think that's a big mis...
Amkor breaks ground on advanced chip packaging campus in Arizona, with production expected by early 2028; state officials say Amkor's investment could reach $7B
Amkor moves in next door to TSMC as CHIPS Act funding continues to turn the Phoenix metro area into a chips hub.
Some lawyers and bankers say the Intel deal may face legal challenges as the CHIPS Act may not allow the US government to convert grants into equity
and every American should be [video] Kelsey Piper / @kelseytuoc : @recurseparadox Congress can repeal the CHIPS act if they want to. (I think they shouldn't, but they could). But ‘Congress authorized ...
GlobalFoundries plans to spend $16B to boost domestic chip production, including $13B on its New York and Vermont plants and $3B for advanced packaging research
Ian King / Bloomberg :
Sources: TSMC is close to finalizing specs for a new chip packaging method, known in the industry as “panel-level”, to meet rising demand for powerful AI chips
TAIPEI — Taiwan Semiconductor Manufacturing Co. is close to finalizing the specifications for a radically new approach …
An in-depth look at TSMC's $165B US investment plans: three new Fab 21 phases, two new advanced packaging facilities, and an R&D center, all based in Phoenix
Timing, locations, and technologies not disclosed. — On Monday, TSMC announced plans to invest $100 billion in expanding its U.S. manufacturing capacity.